IoT groups combine efforts in emerging fragmented market: Page 3 of 3

November 30, 2015 // By Rick Merritt, EE Times
IoT groups combine efforts in emerging fragmented market
The Open Interconnect Consortium (OIC) will acquire assets of and combine its technologies with those of the Universal Plug and Play Forum (UPnP), a fifteen-year old group focused on automating links between PCs and peripherals typically over Wi-Fi. By adopting the UPnP’s widely used service discovery software and likely many of its members, OIC will bolster its position as an applications-layer software stack for the Internet of Things.

The OIC/UPnP deal was a good fit in part because Intel was a prime mover helping form both groups. AllSeen was originally a project of archrival Qualcomm.

The World Wide Web Consortium is working on its own recommendations for application-layer software for IoT. Richmond suggested OIC is in a good position to be adopted for the effort. “They are good at using specs by reference and [implementations based on] Javascript,” he said.

As part of the deal, OIC will form a new UPnP Work Group to maintain the UPnP specifications, and certification tools within the overall OIC organization. OIC will offer legacy UPnP certification for a fee to companies who choose not to join OIC.

— Rick Merritt, Silicon Valley Bureau Chief, EE Times

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