"Having a prestigious test equipment vendor like Agilent on board for interoperability testing is of huge importance to Altair," said Eran Eshed, cofounder and VP of Marketing and Business Development at Altair Semiconductor. "Verifying and certifying leading-edge designs is always a challenge, and this collaboration ensures that the chipset technology and the testing solutions move forward together at an accelerated pace, allowing our products to be brought to market quickly and efficiently."
Altair’s LTE chip portfolio includes the FourGee-3100 baseband and FourGee-6200 RFIC chipsets.
The FourGee-3100 is a 3GPP LTE baseband processor that supports LTE category 3 throughputs (100Mbps/50Mbps DL/UL respectively). The chip implements a 20-MHz MIMO receiver and is based on a proprietary, cutting-edge O²P software-defined radio processor. T
The FourGee-6200 is a multiband RF transceiver that supports any 3GPP LTE band in the range of 700 MHz to 2700 MHz. The chipset supports FDD as well as TDD versions of the LTE standard and, together with Altair’s software stack, has been extensively interoperability-tested with leading infrastructure vendors in multiple-band and duplex configurations.
"Our work with Altair lends to our on-going interoperability testing with the PXT and validation of Agilent’s conformance test solutions," said Guy Séné, vice president and general manager of Agilent’s Microwave and Communications Division. "Altair’s chipset will be used to further increase the capability of our LTE test platforms, expanding our design verification and conformance test capability into new operating bands."
In addition to interoperability testing, the Altair chipset will be used for validation of 3GPP test cases running on the Agilent N6070A-series Signaling Conformance Test solution.