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MediaTek conducts interoperability tests with SoftBank to drive NB-IoT in Japan

Business news |
By Wisse Hettinga

This interoperability test will further efforts to advance MediaTek’s NB-IoT technology and ready the connectivity standard for global deployment.

MediaTek has played a pivotal role in the formulation and implementation of the 3GPP LPWA specification for NB-IoT. The company recently unveiled its highly integrated and ultra-low-power MT2625 NB-IoT System-on-Chip (SoC) and announced its collaboration with China Mobile to build the world’s smallest NB-IoT module (16- x 18-mm) around the chipset.

The MT2625 NB-IoT chipset is built to meet the requirements of cost-sensitive and small IoT devices and leverages MediaTek’s advanced power consumption technology to enable IoT devices to work with batteries for years. The highly integrated SoC combines an Arm® Cortex®-M microcontroller (MCU), pseudo-static RAM (PSRAM), flash memory and power management unit (PMU) into a small package to lower the cost of production while also speeding up time-to-market. The MT2625 supports a full frequency band(from 450 MHz to 2.1 GHz) of 3GPP R13 (NB1) and R14 (NB2) standards for a wide range of IoT applications including smart home control, logistics tracking and smart meters.

www.mediatek.com


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