MediaTek has unveiled the Dimensity 700 5G smartphone chipset, a 7nm 5G SoC designed to bring advanced 5G capabilities and experiences to the mass market. The addition of this 7nm SoC to the Dimensity family of 5G chips gives device makers a full suite of options for 5G smartphone models – from flagship and premium to mid-range and mass market devices – making 5G more accessible for consumers everywhere.
The Dimensity 700 packs advanced connectivity features including 5G Carrier Aggregation (2CC 5G-CA) and 5G dual SIM dual standby (DSDS), giving users access to the fastest speeds and 5G-exclusive Voice over New Radio (VoNR) services from either connection. On the processing power side, the chip integrates two Arm Cortex-A76 big cores in its octa-core CPU and operates at up to 2.2 GHz.
"With our expanded Dimensity portfolio we're bringing the latest 5G capabilities to every smartphone tier so more people can enjoy 5G experiences," said Dr. JC Hsu, Corporate VP and GM of MediaTek's Wireless Communications Business Unit. "The Dimensity 700 has an impressive mix of 5G connectivity features, advanced camera capabilities like night shot enhancements and multiple voice assistant support, all in a super power-efficient design."
The 5G SoC features MediaTek 5G UltraSave, which delivers advanced power-saving technologies to improve battery life. It includes UltraSave Network Environment Detection, MediaTek 5G UltraSave OTA Content Awareness, Dynamic BWP and Connected Mode DRX. The built-in technology intelligently manages a device's 5G connection so you can do more and charge your device less often.